| VMR3020 + NWL860T |
| Compatible wafer sizes |
ø150mm/200mm (SEMI/JEIDA compliant, silicon) |
| Standard wafer carriers |
Entegris® 150mm: PA182-60MB, 200mm: 192-80M |
Processing speed per carrier
(Continuous transfer of 25 wafers) |
8 minutes + NEXIV's measurement time |
| Orientation flat/notch detection |
Non-contact, transmitted-type sensor |
| Wafer transfer/chuck |
Vacuum chuck, mechanical transfer |
|
Main unit dimensions (excluding PC rack)
|
1700 (W) x 960 (D) x 1735 (H) mm (66.9 x 37.8 x 68.3 in.) |
| Footprint (excluding areas for operation and maintenance) |
2750 (W) x 1100 (D) mm (108.3 x 43.3 in.) |
| Main unit weight |
Approx. 370kg (815.7 lb.) |
| Requirements |
Electricity |
AC100-240V±10%, 50/60Hz, 11.5A max. |
| Vacuum |
–800hPa (–600mmHg), 10NI/min. |
