Nikon
Standard Magnification Head Maximum Magnification Module

VMR-C4540

Non-contact, fully automatic measurement provides outstanding throughput. Perfect for measuring FOUP and FOSB.

•Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments
•SEMI-compliant kinematic plate provides perfect XYZ coordinates
•Variety of illumination choices facilitate accurate measurements of registration pin holes and latch-key holes
•Laser AF provides fast, non-contact measurements of wafer positions
•Wide area, high-intensity LED illumination enables accurate measurements of wafer heights
•300mm, 200mm wafer carrier and SMIF Pod base

Specifications

Compatible carriers
(FOUP, FOSB, OC)
SEMI-compliant ø300mm wafer carriers
200mm wafer carriers (with dedicated adapter)
Stroke Measuring head (X x Y x Z) 480 x 180 x 400 mm (18.9 x 7.1 x 15.7 in.)
Rotary table 360° (in 90° increments)
Minimum readout 0.1µm
Head travel speed XZ axis: max. 200mm/s (7.9 in.)
Y axis: max. 50mm/s (2.0 in.)

Kinematic plate rotation speed

90°/2 sec.
Camera B&W 1/2-in. CCD
Optical magnification 0.27X to 2.74X (5-step 10X zoom)
Field of view 20 x 16 mm to 2.0 x 1.6 mm
Max. workpiece weight 15kg (33.1 lb.)
Measuring accuracy (10 + 10L/1000)µm, L = measuring length in mm)
Repeatability (2σ) 2µm
Illumination Episcopic, diascopic, darkfield
Auto focus Laser AF, Vision AF
Power source AC100-240V±10%, 50/60Hz
Power consumption (approx.) AC100-120V: 13A (main unit), 9A (PC)
AC200-240V: 7A (main unit), 5A (PC)
Dimensions 1400 (W) x 1739 (D) x 2530 (H) mm (55.1 x 68.5 x 99.6 in.)
Weight Approx. 1400kg (3086.41 lb.)
Host computer IBM PC/AT (Windows®2000)
Monitor 17-in. TFT

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