 The Confocal NEXIV, a ground-breaking Multi-Functional video measuring system, was developed on the strength of Nikon’s leading opto-mechatronics technologies.
It incorporates confocal technology, brightfield with a 15X zoom, and TTL Laser AF. No matter what geometrical measurements you need-two-dimensional or three-dimensional-inspection and evaluation is exceptionally fast and accurate with this system! The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.
Features
•Market leading Non-Contact Video/Laser Measurement technologies
•Newly developed High Speed Wide Area HeightMeasurementcapability Applications
High Precision Height Measurement
•Height Measurement Repeatability: 0.35µm (2σ with 3x)
•High Speed Height Measurement: 1.5 sec cycle time
Applications
•IC Pack\ages
Flip Chip/COF(Bump)/COG
CSP (FBGA)/SIP (Bump, Wire)
Interposer (Pad height)
•MEMS •Probe Card (Silicon Probe, Au Probe)
•Precise Glass Components (Micro Lens, Contact Lens)
•Photo Spacer Width/Height for Color Filter for FPD Panel
Specifications
| Objective lens |
| Magnification |
1.5x |
3x |
7.5x |
| W.D. |
24mm |
24mm |
5mm |
| Confocal optics (area height measure) |
| Maximum scan height |
1mm |
1mm |
1mm |
| Field of view |
8mm x 6mm |
4mm x 3mm |
1.6mm x 1.2mm |
| Z measurement repeatabillity (2σ) |
0.6µm |
0.35µm |
0.25µm |
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•To request a brochure
•For inquiries about these products |
Measurement Examples
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| Bright Field |
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| Conforcal Image |
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| 3D CF Image |
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| EDF Image |
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| CSP-Bump Height and Size |
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| Bonding Wire-Loop Height |
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