NEXIV VMR Standard Magnification Head Maximum Magnification Module Software Options Specifications Dimensional Diagrams VMR-H3030 VMR-3020 VMR-6555 VMR-10080 NWL860T NWT-3000 VMR-H3030 Z120X VMR-3020 Z120X VMR-6555 Z120X VMR-10080 Z120X VMR-C4540 VMR-K3040ZC

Applications Semiconductor packages (multiple pieces) Substrates Printing masks for substrates Stamped parts (multiple pieces) Connectors (multiple pieces) Injection molded parts (multiple pieces) •650 x 550 mm stage stroke perfect for PCBs •Automatic measurements of small parts by placing multiple pieces together on the stage •Laser AF achieves high-accuracy measurements of bump heights •Laser AF also enables measurements of height gaps and warping in workpieces •Search function enables measurements of lands and holes of PCBs •Search function also provides accurate measurements even when workpieces are not located properly on the stage •Variety of illumination choices facilitate accurate edge detection even for vague geometries •High-speed stage and high-speed image processing provide high throughput Specifications Stroke (XxYxZ) 650 x 550 x 150 mm (25.6 x 21.7 x 5.9 in.) Minimum readout 0.1µm Maximum workpiece weight 30kg (66.1 lb) Measuring accuracy     U1X, U1Y 1.5 + 2.5L/1000µm (with a workpiece max. 30kg)   U2XY 2.5 + 2.5L/1000µm (with a workpiece max. 30kg) Z-axis (L: Length in mm < W.D.) 1.5 + L/150µm Camera B&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD Working distance 50mm Magnification vs field of view     Optical Head for Type 1 0.5 - 7.5X / 9.33 x 7 - 0.622 x 0.467 mm   Optical Head for Type 2 1 - 15X / 4.67 x 3.5 - 0.311 x 0.233 mm   Optical Head for Type 3 2 - 30X / 2.33 x 1.75 - 0.155 x 0.117 mm Auto focus TTL Laser AF and Vision AF Illumination Diascopic, episcopic, 8-segment LED ring illumination (inner ring / outer ring) Power source AC100-240V±10%, 50/60Hz Power consumption Max. 13A Dimensions & weight     Main unit & table 1220 (W) x 1680 (D) 1750 (H) mm, approx. 600kg (48.0 x 66.1 x 68.9 in., 1322.8 lb.)   Controller 250 (D) x 550 (D) x 500 (H) mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.) Footprint 2400 (W) x 2000 (D) mm (94.5 x 78.7 in.) Host Computer Main unit IBM PC/AT (Windows®2000) Monitor 17-in. TFT color •To request a brochure •For inquiries about these products Measurement Examples PCB LCD Molded part Insertion pin of semiconductor package Fine metal part and its 2D profile overlaid win a master shape Result evaluation diagram of a metal part

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