Nikon
Standard Magnification Head Maximum Magnification Module

VMR-H3030 Z120X

Ultrahigh-precision Type with Maximum Magnification ModuleNEXIV VMR-H3030 Z120X

Applications
Wafer level CSP
Wafer level bump heights
Wafer level SIP
Rerouted masks
Masks for MEMS

•120X optical magnification enables measurements of rerouted patterns on wafer level CSP
•High precision stage facilitates accurate measurements even for wider dimensions
•Enables measurements of top and bottom widths of etched lines, respectively
•Laser AF facilitates measurements of minuscule bump heights
•Enables evaluation of cross-sectional shapes of bumps and solder balls

Specifications

Stroke (XxYxZ)  
  With high magnification lens 300 x 300x 150 mm (11.8 x 11.8 x 5.9 in.)
  With low magnification lens 250 x 300x 150 mm (9.8 x 11.8 x 5.9 in.)
Minimum readout 0.01µm
Maximum workpiece weight 30kg (66.1 lb)
Measuring accuracy  
  U1X, U1Y 0.6 + 2L/1000µm (with a workpiece max. 10kg)
  U2XY 0.9 + 3L/1000µm (with a workpiece max. 10kg)
Z-axis (L: Length in mm < W.D.) 0.9 + L/150µm
Camera B&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD
Working distance High mag. objective lens: 9.8mm
Low mag. objective lens: 32mm
Magnification vs field of view 1 - 120X / 4.67 x 3.5 - 0.039 x 0.029 mm
Auto focus TTL Laser AF and Vision AF
Illumination Episcopic, diascopic (with high mag. head only), darkfield illumination
Power source AC100-240V±10%, 50/60Hz
Power consumption Max. 13A
Dimensions & weight  
  Main unit only 915 x 1060 x 1300 mm, approx. 450kg
(36.0 x 41.7 x 51.2 in., 992.1 lb.)
  Main unit & table 1000 x 1100 x 1900 mm, approx. 570kg
(39.4 x 43.3 x 74.8 in., 1256.6 lb.)
  Controller 250 (D) x 550 (D) x 500 (H) mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.)
Footprint 2400 (W) x 1400 (D) mm (94.5 x 55.1 in.)
Host Computer
Main unit IBM PC/AT (Windows®2000)
Monitor 17-in. TFT color
*The"Z120X"type is equivalent to the " Z120X"type in Japan.

•To request a brochure
•For inquiries about these products
Measurement Examples
Rerouted pattern
Rerouted pattern
Photo mask
Photo mask
Flip chip bump and its 3D graphic
Flip chip bump and its 3D graphic
Surface analysis of flip chip bump (optional)
Surface analysis of flip chip bump (optional)

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